A funded PhD position is currently available on to develop a low temperature bonding process using metallic multilayer or alloy nanowires, within the Heterogeneous System Integration group at the Tyndall National Institute.
The goal of this project is to develop new paradigms in IC packaging and assembly technologies by means of interconnect formation using submicron wire and nanowire anisotropic conductive film. Compared to tradition anisotropic conductive film, submicron wire and nanowire-polymer film should allow high density interconnections along z-axis and should not suffer from co-planarity issues and allow lower bond pitch sizes. However, low temperature bondability and reliability of these nanowire-polymer composites is not yet studied in detail.
The project will focus on:
1. A review on different polymers which has low melting point will be carried out. Similarly, a selection of low temperature alloys and preferably metal nano particle or nano particle based alloys will be considered.
2. Fabrication of the alloy or multilayer nanowire-polymer nanocomposites.
3. Develop a Flip chip bonding process using the fabricated nanowire-polymer film for z-axis interconnections.
4. Detailed structural, electrical, electromechanical and reliability characterization of the bonded chip and wafers.
Applications are invited from scientists and engineers who hold (or expect to obtain before October 2010) a first or second class honours undergraduate degree in, electronic/electrical engineering, applied physics, materials science or a closely related discipline.
The successful student will receive training in all research methods required, and will work alongside experienced professional researchers and postdoctoral fellows within the Heterogeneous System Integration Group, attend conferences and publish in high impact journals.
For further information on this position, please contact Dr. Kafil M. Razeeb, Heterogeneous System Integration Group, Tyndall National Institute (Email: kafil.mahmood@tyndall.ie).
To apply, please submit a CV to careers@tyndall.iequoting the reference number.
At this time, Tyndall National Institute does not require the assistance of recruitment agencies.
Tyndall National Institute is an Equal Opportunities Employer.
The goal of this project is to develop new paradigms in IC packaging and assembly technologies by means of interconnect formation using submicron wire and nanowire anisotropic conductive film. Compared to tradition anisotropic conductive film, submicron wire and nanowire-polymer film should allow high density interconnections along z-axis and should not suffer from co-planarity issues and allow lower bond pitch sizes. However, low temperature bondability and reliability of these nanowire-polymer composites is not yet studied in detail.
The project will focus on:
1. A review on different polymers which has low melting point will be carried out. Similarly, a selection of low temperature alloys and preferably metal nano particle or nano particle based alloys will be considered.
2. Fabrication of the alloy or multilayer nanowire-polymer nanocomposites.
3. Develop a Flip chip bonding process using the fabricated nanowire-polymer film for z-axis interconnections.
4. Detailed structural, electrical, electromechanical and reliability characterization of the bonded chip and wafers.
Applications are invited from scientists and engineers who hold (or expect to obtain before October 2010) a first or second class honours undergraduate degree in, electronic/electrical engineering, applied physics, materials science or a closely related discipline.
The successful student will receive training in all research methods required, and will work alongside experienced professional researchers and postdoctoral fellows within the Heterogeneous System Integration Group, attend conferences and publish in high impact journals.
For further information on this position, please contact Dr. Kafil M. Razeeb, Heterogeneous System Integration Group, Tyndall National Institute (Email: kafil.mahmood@tyndall.ie).
To apply, please submit a CV to careers@tyndall.iequoting the reference number.
At this time, Tyndall National Institute does not require the assistance of recruitment agencies.
Tyndall National Institute is an Equal Opportunities Employer.
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